The semiconductor industry's evolution positions it as a highvalue, technologyintensive sector in the 21st century, making it a core component in various domains like computers, consumer electronics, network communication,high voltage probe and automotive electronics. Consisting of integrated circuits, optoelectronic devices, discrete devices, and sensors, the semiconductor industry's forefront is marked by rapid developments in semiconductor physics, devices, and manufacturing processes.
Primary Equipment in Semiconductor Production:
1. Monocrystalline Furnace:
Melts semiconductor materials to produce wafer chuck single crystal semiconductor blanks crucial for subsequent device manufacturing.
2. Vapor Phase Epitaxy Furnace:
Provides a controlled environment for vapor phase epitaxy growth,manual prober enabling the creation of thin layers on single crystal substrates.
3. Molecular Beam Epitaxy Conducting System:
Facilitates the growth of thin films on a substrate, ensuring precise cell growth and maintaining correspondence with the substrate's crystalline direction.
4. Oxidation Furnace (VDF):
Oxidizes semiconductor materials, creating the necessary oxidizing atmosphere for planned semiconductor oxidation processes.
5. Low Pressure Chemical Vapor Deposition System (LPCVD):
Introduces reactant vapors into the LPCVD chamber to initiate chemical reactions on the substrate surface, forming thin films.
6. Plasma Enhanced Chemical Vapor Deposition (PECVD) System:
Deposits semiconductor thin films on substrates through chemical reactions postionization in the deposition chamber.
7. Magnetron Sputtering Station (MSA):
Utilizes magnetic fields and ionization to deposit target atoms or molecules onto substrates, forming thin films.
8. Chemical Engineering Mechanical Polishing Machine (CMP):
Combines mechanical grinding and chemical dissolution to achieve comprehensive grinding and polishing of semiconductor bodies.
9. Photolithography:
Transfers patterns from masks to semiconductor substrates, temporarily replicating device or circuit structures.
10. Reactive Ion Etching System (RIE):
Applies highfrequency voltage to enable chemical reaction etching and physical impact, molding the semiconductor during processing.
11. CP Plasma Etching System:
Forms plasma from gas atoms or molecules to achieve directional corrosion and accelerated corrosion of the etching surface.
12. Wet Etching Cleaning Machine:
Immerses etching materials in a solution for corrosion, ensuring thorough cleaning to minimize contamination and enhance device performance.
13. Ion Implantation Machine (IBI):
Dopes the semiconductor material's surface area to study development near the surface.
14. Probe Test Bench:
Conducts electrical testing through probe contact with semiconductor device pads to verify if performance aligns with design specifications.
15. Wafer Thinning Machine:
Thins wafers by polishing for subsequent processing.
16. Wafer Slicer (DS):
Slices wafers into smaller pieces using molds.
17. Lead Wire Bonding Machine:
Connects pads on semiconductor chips and pins using conductive metal wires.
The semiconductor industry's transformation from follower to leader requires innovative strides, especially in equipment technology. This innovation will propel China's semiconductor equipment into a new era, fostering technological leaps and upgrades in chip processes and technologies.
